Two-component, 100%-solids epoxy system for

generalpurpose stress analysis. Transparent, medium

viscosity. Cure time as low as six hours at +125°F (+50°C).

Recommended for more critical applications, including

transducers. It has a longer pot life than M-Bond AE-10

which allows more time for multiple gage installations.

Strain Gage Adhesive

Elevated-temperature postcure is recommended for

maximum stability, and/or tests above room temperature.

Highly resistant to moisture and most chemicals,

particularly when postcured. For maximum elongation,

bonding surface must be roughened. Cryogenic

applications require very thin gluelines.

CHARACTERISTICS

PARAMETER DETAILS

OPERATING TEMPERATURE

RANGE

Long Term: –452° to +200°F (–269° to +95°C).

Transducers: to +175°F (+80°C).

ELONGATION CAPABILITIES 2% at –320° (–195°C), 10% to 15% at +75°F (+24°C), 15% at +200°F (+95°C).

SHELF LIFE

Minimum 12 months at +75°F (+24°C); or 18 months at +40°F (+5°C). If crystals form in resin jar,

heat to +120°F (+50°C) for 30 minutes. Cool before mixing.

Refer to product label for most recent information.

POT LIFE 1-1/2 hours at +75°F (+24°C).

CLAMPING PRESSURE 5 to 20 psi (35 to 140 kN/m2

).

CURE REQUIREMENTS*

Recommended Postcure:

2 hours at 25°F (15°C) above

maximum operating

temperature.

Optimum Performance

Transducer Postcure:

1 hour at +200°F (+95°C).